SOT-MRAM

SOT-MRAM (spin-orbit torque MRAM) has the potential to challenge STT-MRAM, as it is a faster, denser and much more efficient memory technology.

SOT-MRAM devices feature switching of the free magnetic layer done by injecting an in-plane current in an adjacent SOT layer, unlike STT-MRAM where the current is injected perpendicularly into the magnetic tunnel junction and the read and write operation is performed through the same path.

In June 2018, researchers from Imec fabricated SOT-MRAM devices on 300mm wafers using CMOS compatible processes, for the first time.

The latest SOT-MRAM news

Researchers from IST and Western Digital develop a promising new SOT-MRAM material

Researchers from the Institute of Science Tokyo (formerly Tokyo Tech), in collaboration with Western Digital, has developed a new high-performance material suitable for low-power SOT-MRAM.

The researchers are using BiSb material under the CoFeB/MgO, with perpendicular magnetic anisotropy. By optimizing the interfacial layer thickness as well as deposition condition of BiSb, the researchers managed to achieve a large effective spin Hall angle and relatively high electrical conductivity. The researchers continued to demonstrate spin–orbit torque-induced magnetization switching driven by a small threshold current density.

Read the full story Posted: Oct 10,2024

Leading the Charge in MRAM: An Interview with Everspin's CEO

Everspin Technologies is at the forefront of the MRAM industry, with a product range that spans Toggle MRAM and STT-MRAM, embedded MRAM IP, more. The company's president and CEO, Sanjeev Aggarwal, was kind enough to answer a few questions we had about the company, it's recent announcements and its future roadmap.

Thank you for your time Sanjeev, we appreciate it. A few days ago, Everspin announced it had received a strategic $14.55 million 2.5-year DoD project to provide continued and stable manufacturing services. Can you share more info? How will that money be allocated, and how will you ensure stable support?

Everspin has partnered with the DoD on various projects to deploy our MRAM technology and fab MRAM products for Defense Industrial Base customers in Chandler, Arizona. The award money will be used to strength the US MRAM manufacturing supply chain.  Everspin will look at its supply chain and mitigate any risks identified. This can include second-sourcing gases and chemicals as well as upgrading processes.  

Read the full story Posted: Sep 04,2024 - 2 comments

CEA-Leti and NY CREATES to co-develop STT-MRAM and SOT-MRAM devices on 300 mm wafers

The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) and CEA-Leti announced a two-year strategic R&D partnership, that will initially focus on the research and co-development of MRAM devices.

NY CREATES and CEA-Leti will develop and produce both STT-MRAM and SOT-MRAM devices on 300 mm substrates. CEA-Leti will contribute its expertise in magnetics, spintronics, and the testing of related devices, and NY CREATES will provide the facilities, process integration expertise, and materials process development to run the 300mm silicon hardware.

Read the full story Posted: Jun 27,2024

ITRI and TSMC announce advances in SOT-MRAM development

In 2022, Taiwan's Industrial Technology Research Institute (ITRI) announced an agreement with Taiwan Semiconductor Manufacturing Company (TSMC) to collaborate on SOT-MRAM R&D. ITRI and TSMC now announced that they have developed SOT-MRAM array chips that boasts a power consumption of merely one percent of a comparable STT-MRAM device. 

ITRI and TSMC published a new research paper that was presented at the 2023 IEE International Electron Devices Meeting (IEDM 2023). ITRI explains that the new unit cell achieves simultaneous low power consumption and high-speed operation, reaching speeds as rapid as 10 nanoseconds. And its overall computing performance can be further enhanced when integrated with computing in memory circuit design. 

Read the full story Posted: Jan 18,2024 - 1 comment

Researchers demonstrate fast BiSb p-MTJ switching, to enable fast and low-power SOT-MRAM devices

Researchers from the Tokyo Institute of Technology have successfully demonstrated fast p-MTJ switching (1 ns, compared to current switching that is >10 ns). "The researchers achieved this using the topological insulator BiSb as the SOT layer, and say the device offers a current density about 20 times smaller than typical.

The researchers say that this technology can be applied to develop p-MTJs for SOT-MRAM that will offer ultrafast operations and ultra low power consumption, while also offering higher reliability. This follows earlier work by the same group on BiSb p-MTJs.

Read the full story Posted: Sep 02,2023 - 2 comments

Researchers say MnPd3 will enable a breakthrough in SOT-MRAM memory devices

Researchers from the School of Engineering at Stanford University discovered that a metallic compound called manganese palladium three MnPd3 is a promising material to build SOT-MRAM memory devices. 

The researchers say that the new material enables a breakthrough in SOT-MRAM device performance, as it is the first material that generates spin in the z-direction, rather than the y-direction as in most materials, which is a property needed in high-performance SOT-MRAM. In fact MnPd3 is able to generate spins in any orientation because its internal structure lacks the kind of crystal symmetry that would force all of the electrons into a particular orientation.

Read the full story Posted: May 10,2023

Hprobe releases a new MRAM testing module to help increase production yields

Hprobe, a developer of testing equipment for magnetic devices, announced a new addition to its product line, the RF Pulse Module. The company says that this is the commercially available testing system to both collect statistics of error rate of the memory unit cell and take a deep look into switching dynamics of resistive memories.

Hprobe IBEX WAT H3DM Light photo

Hprobe's IBEX system

Hprobe says that the RF Pulse Module is two orders of magnitude faster than existing devices and can help increase manufacturing yields. Hprobe has already begun shipping to tier-1 companies and major research institutes around the world.

Read the full story Posted: Dec 03,2022

ITRI joins forces with TSMC and NYCU to develop next-gen MRAM technologies

Taiwan's Industrial Technology Research Institute (ITRI) announced two new MRAM collaborations. The first one is with Taiwan's TSMC, for the development of SOT-MRAM array chips. The second collaboration is with National Yang Ming Chiao Tung University (NYCU) to develop magnetic memory technology that can perform across a wide operating temperature range of nearly 400 degrees Celsius.

Together with TSMC, ITRI is developing low-voltage and current SOT-MRAM, that features high write efficiecny and low write voltage. ITRI says that its SOT-MRAM achieves a writing speed of 0.4 nanoseconds and a high endurance of 7 trillion reads and writes. The memory also offers a data storage lifespan of over 10 years.

Read the full story Posted: Jun 28,2022

ISI introduces a new 3-Axis magnet option for its MRAM tester systems, targeting STT-MRAM and SOT-MRAM testing

Integral Solutions International (ISI) announced a new 3-Axis Magnet Option for wafer-level testing. Combined with ISI's WLA5000 Tester, the 3D magnetic fields produced by this system can be used for characterization of MRAM devices in addition to 2D/3D Magnetic Sensors.

ISI WLA5000 MRAM tester

ISI says that for MRAM applications, the 3D Magnetic fields produced by ISI’s 3-Axis Magnet Option delivers solutions for both STT-MRAM and SOT-MRAM applications.

Read the full story Posted: Mar 04,2022

ITRI and UCLA to co-develop VC-MRAM technologies

Taiwan-based Industrial Technology Research Institute (ITRI) announced an agreement with the University of California, Los Angeles (UCLA) to co-develop Voltage-Control MRAM (VC-MRAM) technologies.

UCLA-ITRI-VC-MRAM-prototype

ITRI says that VC-MRAM is a type of SOT-MRAM that offers improved performance - 50% higher writing speed and 75% less energy consumption. VC-MRAM is said to be ideal for AIoT and automotive industry applications. The partnership is expected to strengthen the link between both parties and accelerate the R&D and industrialization of new memory technologies.

Read the full story Posted: Mar 04,2022