MRAM News, Resources & Information
MRAM is a next-generation memory technology, based on electron spin rather then its charge. Often referred to as the "holy-grail of memory", MRAM is fast, high-density and non-volatile and can replace all kinds of memories used today in a single chip.
Written for scientists, researchers, and engineers, This book describes the recent research and implementations in relation to the design of a new generation of non-volatile electronic memories.
The objective is to replace existing memories (DRAM, SRAM, EEPROM, Flash, etc.) with a universal memory model likely to reach better performances than the current types of memory: extremely high commutation speeds, high implantation densities and retention time of information of about ten years.
Crocus Technology announced a new magnetic sensor that can be used to detect the shape and bendability of flexible displays. The company discovered a technique to turn their MRAM memory cell arrays into very sensitive magnetic sensors that have a much larger range than any commercial sensor.
The production process is very similar to the MRAM process the company uses, but with a different cell design. Basically it is a very simple sensor that detects changes in a magnetic field from a perpendicular magnet.
Everspin Technologies entered into a partnership with GlobalFoundries to build fully processed 300mm wafers with Everspin's ST-MRAM technology, starting with GF's 28-nm and 40-nm low-power CMOS platforms. As part of the agreement, GlobalFoundries invested an undisclosed amount in Everspin, and they already acquired ST-MRAM processing equipment (40-nm).
Everspin hopes that the new agreement will help drive ST-MRAM adoption and will offer higher volume production at lower cost. The company reports that they shipped over 40 million MRAM chips - which represents very fast growth as in August 2013 they reported selling 10 million MRAM chips so they sold almost 30 million chips in just over a year (it took them over 4 years to sell the first 10 million).
Crocus Technology launched a new project (called Miultismart) to develop secure multibit architecture for its Magnetic Logic Unit (MLU) technology. Crocus will collaborate with Gemalto and the French research laboratories at LIRMM and IM2NP.
A multibit architecture will enable Crocus to increase the memory density without changing the die size. As part of this project, Gemalto will develop a new operating system suitable for this MCU and LIRMM and IM2NP will test, qualify and characterize the end product - a secure microcontroller with a secure element.
A few days ago I reported that TDK will show a new STT-MRAM prototype, and now we have some more information and a couple of photos of the new test chip. TDK is showing their first STT-MRAM chip, a 8Mb device, produced on a 8" silicon substrate.
This is the first time TDK exposed their STT-MRAM technology. Those MRAM chips were produced by TDK's Headway Technologies. TDK will not mass poroduce MRAM chips themselves but rather seek a chip-making partner to produce them. But this may take a while: TDK says it could be up to 10 years before the technology matures (earlier reports said TDK estimates that it will take 3 years to commercialize this technology).
According to a report from Japan, TDK Corp is going to present a prototype 8-Mbit STT-MRAM device today at Ceatec Japan 2014. The MRAM was produced on a 8" silicon substrate. Hopefully TDK will give more details on this achievement later today.
The report further says that TDK aims to commercialize STT-MRAM chips in 3-5 years.
This book presents a systematic overview of emerging non-volatile memory technologies. The book discusses recent improvements in flash technologies (such as 3D NAND), phase change memory and resistive random access memory technologies and alternative technologies such as STT-MRAM, ferroelectric and organic memory devices.