MRAM News, Resources & Information

MRAM is a next-generation memory technology, based on electron spin rather then its charge. Often referred to as the "holy-grail of memory", MRAM is fast, high-density and non-volatile and can replace all kinds of memories used today in a single chip.

Everspin raised $29 million from Global Foundries, Western Digital and others

Everspin Technologies announced that it closed a $29 million funding round, led by Global Foundries and Western Digital Capital. Existing investors (New Venture Partners, Lux Capital, Sigma Partners, Epic Ventures, and Draper Fisher Jurvetson) also joined in the round.

In October 2014 Everspin entered into a partnership with GlobalFoundries to build fully processed 300mm wafers with Everspin's ST-MRAM technology. In October it was announced that GF acquired a stake in Everspin (this is probably before this recent investment) and also acquired ST-MRAM processing equipment (40-nm).

Micron and A*STAR extend their STT-MRAM collaboration for three more years

In October 2011, Micron and Singapore's A*STAR Data Storage Institute (DSI) announced a 3-year STT-MRAM co-development project. Today they announced that they extend this collaboration for three more years.

DSI and Micro are co-developing high-density STT-MRAM devices. Micron established a technology centre in Singapore, with help from the DSI, which also provided the necessary expertise and innovation to achieve successful fabrication of STT-MRAM devices. In the next three years, the research collaboration will focus on developing low-power consumption switching mechanisms, and improving the performance of STT-MRAM devices.

New MRAM book: Non-volatile Memories

Written for scientists, researchers, and engineers, This book describes the recent research and implementations in relation to the design of a new generation of non-volatile electronic memories.

The objective is to replace existing memories (DRAM, SRAM, EEPROM, Flash, etc.) with a universal memory model likely to reach better performances than the current types of memory: extremely high commutation speeds, high implantation densities and retention time of information of about ten years.

Crocus developed MRAM-based magnetic sensors for flexible displays

Crocus Technology announced a new magnetic sensor that can be used to detect the shape and bendability of flexible displays. The company discovered a technique to turn their MRAM memory cell arrays into very sensitive magnetic sensors that have a much larger range than any commercial sensor.

Crocus MRAM-based flexible display sensor photo

The production process is very similar to the MRAM process the company uses, but with a different cell design. Basically it is a very simple sensor that detects changes in a magnetic field from a perpendicular magnet.

Everspin signs production agreement with GlobalFoundries, sold over 40 million MRAM chips

Everspin Technologies entered into a partnership with GlobalFoundries to build fully processed 300mm wafers with Everspin's ST-MRAM technology, starting with GF's 28-nm and 40-nm low-power CMOS platforms. As part of the agreement, GlobalFoundries invested an undisclosed amount in Everspin, and they already acquired ST-MRAM processing equipment (40-nm).

Everspin EMD3D064M photo

Everspin hopes that the new agreement will help drive ST-MRAM adoption and will offer higher volume production at lower cost. The company reports that they shipped over 40 million MRAM chips - which represents very fast growth as in August 2013 they reported selling 10 million MRAM chips so they sold almost 30 million chips in just over a year (it took them over 4 years to sell the first 10 million).

Crocus to develop multibit architecture for its MLU technology

Crocus logoCrocus Technology launched a new project (called Miultismart) to develop secure multibit architecture for its Magnetic Logic Unit (MLU) technology. Crocus will collaborate with Gemalto and the French research laboratories at LIRMM and IM2NP.

A multibit architecture will enable Crocus to increase the memory density without changing the die size. As part of this project, Gemalto will develop a new operating system suitable for this MCU and LIRMM and IM2NP will test, qualify and characterize the end product - a secure microcontroller with a secure element.

More details on TDK's new 8Mb STT-MRAM prototype

A few days ago I reported that TDK will show a new STT-MRAM prototype, and now we have some more information and a couple of photos of the new test chip. TDK is showing their first STT-MRAM chip, a 8Mb device, produced on a 8" silicon substrate. 

TDK STT-MRAM wafer/chip CEATEC 2014 photo

This is the first time TDK exposed their STT-MRAM technology. Those MRAM chips were produced by TDK's Headway Technologies. TDK will not mass poroduce MRAM chips themselves but rather seek a chip-making partner to produce them. But this may take a while: TDK says it could be up to 10 years before the technology matures (earlier reports said TDK estimates that it will take 3 years to commercialize this technology).

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