MRAM: Next generation memory technology

Riber has launched a new innovative robotic system, the MPVD300 reactor.  Based on a high vacuum deposition system (UHV) and compatible with existing silicon FAB industry standards, the MPVD 300 provides unrivalled precision of control and composition uniformity defects of less than 1% over 300mm (monoatomic layer precision).

Riber sayst he new machine willhelp make new ultra-fast microprocessors and high-capacity MRAM.

Fully automated, Riber's MPVD300 is the only modular system for high vacuum deposition that can beconnected up directly to the silicon production line. The first system will be shipped in July to a major manufacturer in Asia.

Crocus announced today that Israeli Tower fab will manufacture their next-gen MRAM chips. Tower has an exclusive agreement to make the MRAM chips at their 200mm Fab2 facility. Tower has also invested 1.25$ at Crocus.

Crocus aims to start making the chips towards the end of 2009.

A couple of days ago we reported that NEC are working towards perpendicular MRAM using 2T1MTJ... now we have some more info, thanks to TechOn.

NEC and NEC Electronics employed a new method called "spin torque domain wall displacement write method" to reduce write current and realize microfabrication at the same time. In fact, they aim to reduce the current by as much as 90%. They were also able to increase speed to 500Mhz. This technology is not 'new', it was announced in 2007, but now they have a test chip ready.

A japanese site reports that NEC are working towards a perpendicular MRAM cell using "2T1MTJ" technique. NEC are apparently using a 55nm process.

Details are not very clear as the translation is not so good... Hopefully more details will emerge soon.

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This interdisciplinary approach to the topic brings together reviews of the physics, chemistry, fabrication and application of magnetic nanoparticles and nanostructures within a single cover. With its discussion of the basics as well as the most recent developments, and featuring many examples of practical applications, the result is both a clear and concise introduction to the topic for beginners and a guide to relevant comprehensive physical phenomena and essential technological applications for experienced researchers.

From the Back Cover:

Micromem announced that they have raised 375K$ in a private placement.

They will use the proceeds from the offering for general working capital purposes.

Everspin has shipped more than 100K 4Mbit MRAM chips to Siemens’ Industry Automation division. Siemens uses the MRAM in an industrial touch-screen application. They have reported zero field failures over the last two years.

EverSpin MR2A16 Chips

Siemens uses Everspin MRAM to maintain software-programmable logic controller (SoftPLC) process data for its Simatic Multipanel MP 277 and MP 377 multi-panel human machine interface (HMI) products without battery backup.

Siemens started using the MRAM back in March 2008.