SOT-MRAM

SOT-MRAM (spin-orbit torque MRAM) has the potential to challenge STT-MRAM, as it is a faster, denser and much more efficient memory technology.

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SOT-MRAM vs STT-MRAM bitcell

SOT-MRAM devices feature switching of the free magnetic layer done by injecting an in-plane current in an adjacent SOT layer, unlike STT-MRAM where the current is injected perpendicularly into the magnetic tunnel junction and the read and write operation is performed through the same path.

In June 2018, researchers from Imec fabricated SOT-MRAM devices on 300mm wafers using CMOS compatible processes, for the first time.

The latest SOT-MRAM news

ITRI joins forces with TSMC and NYCU to develop next-gen MRAM technologies

Taiwan's Industrial Technology Research Institute (ITRI) announced two new MRAM collaborations. The first one is with Taiwan's TSMC, for the development of SOT-MRAM array chips. The second collaboration is with National Yang Ming Chiao Tung University (NYCU) to develop magnetic memory technology that can perform across a wide operating temperature range of nearly 400 degrees Celsius.

Together with TSMC, ITRI is developing low-voltage and current SOT-MRAM, that features high write efficiecny and low write voltage. ITRI says that its SOT-MRAM achieves a writing speed of 0.4 nanoseconds and a high endurance of 7 trillion reads and writes. The memory also offers a data storage lifespan of over 10 years.

Read the full story Posted: Jun 28,2022

ISI introduces a new 3-Axis magnet option for its MRAM tester systems, targeting STT-MRAM and SOT-MRAM testing

Integral Solutions International (ISI) announced a new 3-Axis Magnet Option for wafer-level testing. Combined with ISI's WLA5000 Tester, the 3D magnetic fields produced by this system can be used for characterization of MRAM devices in addition to 2D/3D Magnetic Sensors.

ISI WLA5000 MRAM tester

ISI says that for MRAM applications, the 3D Magnetic fields produced by ISI’s 3-Axis Magnet Option delivers solutions for both STT-MRAM and SOT-MRAM applications.

Read the full story Posted: Mar 04,2022

ITRI and UCLA to co-develop VC-MRAM technologies

Taiwan-based Industrial Technology Research Institute (ITRI) announced an agreement with the University of California, Los Angeles (UCLA) to co-develop Voltage-Control MRAM (VC-MRAM) technologies.

UCLA-ITRI-VC-MRAM-prototype

ITRI says that VC-MRAM is a type of SOT-MRAM that offers improved performance - 50% higher writing speed and 75% less energy consumption. VC-MRAM is said to be ideal for AIoT and automotive industry applications. The partnership is expected to strengthen the link between both parties and accelerate the R&D and industrialization of new memory technologies.

Read the full story Posted: Mar 04,2022

NTU and TSMC researchers develop a new SOT-MRAM structure with high spin-orbital Hall conductivity

Researchers from National Taiwan University in collaboration with TSMC developed a new SOT-MRAM device structure, that features sizable orbital currents. This research promises a pathway for enhancing SOT-MRAM performance by harnessing both the conventional spin currents and the emergent orbital currents.

NTU TSMC PtCr Alloys SOT-MRAMThe new device is based on 3d light transition metals (such as V and Cr) that are incorporated into the classical spin Hall metal Pt. The Pt-Cr alloy enhances the charge-to-spin conversion efficiency which can realize high spin-orbital Hall conductivity, beyond the conventional spin Hall limit.

Read the full story Posted: Feb 27,2022

Researchers developed an ultra low power BiSb-based SOT MRAM device

Researchers from the Tokyo Institute of Technology developed an ultrahigh-efficiency SOT magnetization switching in fully sputtered BiSb–(Co/Pt) multilayers with large perpendicular magnetic anisotropy (PMA).

Scheme of ultra low power BiSb SOT-MRAM device (Tokyo IT)

The new device offers a large spin Hall angle and high electrical conductivity, thus satisfying all the three requirements for SOT-MRAM implementation. The researchers managed to achieve robust SOT magnetization at a low current density despite the large PMA field.

Read the full story Posted: Feb 23,2022

Hprobe launches a next-generation MRAM wafer sort magnetic test head

Hprobe announced a new magnetic test head for MRAM Wafer Sort. The new module, the H3DM-XL, is at the heart of the latest addition to Hprobe’s IBEX line, the IBEX-WS.

Hprobe MRAM Wafer-Sort Magnetic Test Head (IBEX-WS)

The IBEX-WS test equipment integrates 3D magnetic field capabilities, while increasing field area and uniformity for wafer probing large MRAM arrays. It also features a unique patented robotized 3D Field Calibration Unit (FCU) for high-speed field mapping and monitoring.

Read the full story Posted: Dec 01,2021

Taiwan's Semiconductor Research Institute developed an SOT-MRAM device based on a PMA technique

Researchers at Taiwan's Semiconductor Research Institute (TSRI) unveiled a new SOT-MRAM memory device that they developed in collaboration with University scientists.

TSRI SOT MRAM device photo

The new device uses a perpendicular magnetic anisotropy (PMA) technique. According to the TSRI researchers, they are the second team to successfully produce MRAM chips based on PMA (Intel is the first team to have achieved this).

Read the full story Posted: Nov 10,2021

New SOT-MRAM device structure can be scaled up and is highly efficient

Researchers from Northwestern University, in collaboration with researchers from China, Italy and France, developed a new SOT-MRAM device structure that enables deterministic switching without any need for bias magnetic fields.

The new approach, unlike most earlier methods, can be scaled to large wafers with good uniformity, since it doesn't rely on having a structural asymmetry in the device. SOT-MRAM devices based on this structure could be faster and more energy-efficient than current designs.

Read the full story Posted: Aug 09,2021

ISI ships its first SOT-MRAM tester system

Integral Solutions International (ISI) announced its first shipment of a commercial SOT-MRAM tester system. This new equipment was developed by integrating a commercial pulser with ISI’s proprietary bias-tee and measurement electronics.

ISI says that the new tester system generates pulses as narrow as 300pS, suitable for R&D applications which require extremely narrow pulse widths. In parallel, ISI is also developing its proprietary Gen-4 Pulser System, which will provide high-throughput and cost-effective measurement solutions with the flexibility of testing either STT-MRAM or SOT-MRAM devices. The Gen-4 system is expected to be released in the fall of 2021.

Read the full story Posted: Apr 22,2021

Researchers find that FGT is an excellent material for SOT-MRAM devices

Researchers from Seoul's National University and Pohang's University of Science and Technology (POSTECH) report that a 2D iron germanium telluride (Fe3GeTe2, or FGT) layer is an excellent candidate to be used as the basis SOT-MRAM material.

Fe3GeTe2-based SOT-MRAM device structure (POSTECH / SNU)

An SOT-MRAM based on FGT is highly energy-efficient, in fact the researchers say that the measured magnitude of SOT per applied current density is two orders of magnitude larger than the values reported previously for other candidate materials.

Read the full story Posted: Dec 11,2020