MRAM-Info: the MRAM experts

The 2019 MRAM Developer Day will be held on August 5 at the Santa Clara Convention Center (co-located
with Flash Memory Summit), and will center around Everspin's 1Gb MRAM part now in production.

Keynotes from Everspin, Tokyo Electron, and Applied Materials will focus on MRAM as a disruptive technology and on new manufacturing tools and processes for STT-MRAM. Plenary sessions will cover the current state of MRAM technology and MRAM markets and future trends through 2025, while breakout sessions will cover applications briefs, embedded MRAM, development, and AI applications.

Applied Materials unveiled new high-volume manufacturing solutions for next-generation memories. The Endura platform integrates multiple materials engineering technologies along with on-board metrology to create new films and structures.

Applied’s new Endura Clover MRAM PVD platform is made up of nine unique wafer processing chambers all integrated in pristine, high-vacuum conditions. Applied says that this is the industry's first 300-millimeter MRAM system for high-volume manufacturing capable of individually depositing up to five different materials per chamber. The Clover MRAM PVD platform includes on-board metrology that measures and monitors the thickness of the MRAM layers with sub-angstrom sensitivity as they are created to ensure atomic-level uniformity.

A new market report by Objective Analysis and Coughlin Associates expects that stand-alone MRAM and STT-MRAM revenues will grow 170X from 2018 to 2029, reaching almost $4 billion in revenues. The growth of next-generation memory technologies will be mainly driven by displacing today’s less efficient memory technologies like NOR flash and SRAM.

The analysts expect many memory technologies, including DRAM, 3D Xpoint and NAND to grow in the coming years, but the most stellar growth will be of MRAM memories. Shipments in terms of capacity are expected to grow from around 0.1 Petabytes in 2019 to almost 1 million Petabytes by 2029.

Everspin Technologies says that revenues in the second quarter of 2019 (ending today) will be lower than first expected. In May Everspin said that they expect revenues to be in the range of $9.6 million to $10 million, but now it says revenues will be in the range of $8.3 million to $8.5 million.

Everspin gives three reasons to the lower guidance - lower demand from China due to ongoing slowdown, lower data center investments which lowered the demand for enterprise server RAID controllers and a "broad-based reduction in turns business with distributors that occurred late in the quarter".

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Everspin Technologies announced that it completed the development activity and entered the pilot production phase of its 28 nm 1-Gigabit (Gb) STT-MRAM chips. Everspin targets the enterprise infrastructure and data center markets which can utilize its MRAM technology to increase reliability and performance.

Everspin 1-Gb chip family (EMD4E001G) includes both 8-bit and 16-bit DDR4 compatible (ST-DDR4) interface versions of the device and are available in a JEDEC-compliant BGA package.

pMTJ STT-MRAM developer Avalanche Technology announced that it closed its latest funding round led by Thomvest Ventures, having raised $33 million.

Avalanche currently brands its MRAM chips as P-SRAM (persistent SRAM) devices. The new funds will enable the company to develop higher-density P-SRAM devices. In addition, Avalanche says it will develop the higher densities of "persistent DRAM" required for the next generation of machine learning architectures.