MRAM-Info is a news hub and knowledge center born out of keen interest in MRAM memory technologies.
MRAM is a next-generation memory technology, based on electron spin rather then its charge. Often referred to as the "holy-grail of memory", MRAM is fast, high-density and non-volatile and can replace all kinds of memories used today in a single chip.
Everspin Technologies announced its financial results for Q1 2021. Revenues in the quarter increased 1.7% from last year to $10.3 million. The net loss in the quarter was $0.5 million, and the company reported a positive cash flow (of $1.6 million) for the third consecutive quarter.
Everspin estimates that its Q2 2021 revenues will be in the range of $11 million to $12 million.
During a presentation during Persistent Memory Summit, a new slide from TSMC was shown that describes the company's eMRAM roadmap:
As we already know, TSMC is offering 22nm eMRAM option as an eFlash alternative. The company is also looking to develop 14/12 nm eMRAM option to replace SRAM memory (this is interesting as before it was revealed that the company is developing 16nm MRAM). Finally eMRAM is touted as a possible replacement for configuration memory (eFUSE / OTP / Flash).
pMTJ STT-MRAM developer Avalanche Technology announced that it is now shipping new space-grade parallel asynchronous x16-interface high-reliability P-SRAM (Persistent SRAM) memory devices, based on its latest STT-MRAM technology.
Avalanche says that its STT-MRAM devices are smaller and more efficienct compared to Toggle MRAM based products, currently adopted in aerospace applications. The Parallel x16 Space Grade series is offered in 16Mb, 32Mb and 64Mb density options and has asynchronous SRAM compatible 45ns/45ns read/write timings. All three density options currently in production and available within industry standard lead times.
Hprobe, a developer of testing equipment for magnetic devices, announced a 'significant' order for a wafer-level magnetic tester (the company's IBEX tester) from a tier-1 semiconductor manufacturer.
The equipment will be used for research and development of magnetic materials and devices, which represents a very promising technology for MRAM chips and magnetic sensors. The IBEX platform is compatible with 200mm and 300mm automated wafer probers, and is dedicated to testing MRAM magnetic tunnel junctions, bit cells based on STT-MRAM, SOT-MRAM, and Voltage Controlled (VC-MRAM) technologies.
Integral Solutions International (ISI) announced its first shipment of a commercial SOT-MRAM tester system. This new equipment was developed by integrating a commercial pulser with ISI’s proprietary bias-tee and measurement electronics.
ISI says that the new tester system generates pulses as narrow as 300pS, suitable for R&D applications which require extremely narrow pulse widths. In parallel, ISI is also developing its proprietary Gen-4 Pulser System, which will provide high-throughput and cost-effective measurement solutions with the flexibility of testing either STT-MRAM or SOT-MRAM devices. The Gen-4 system is expected to be released in the fall of 2021.
Everspin Technologies announced its preliminary Q4 2020 financial results. Total revenues were $10 million, down from $10.1 million in Q3 and up from $9.7 million in Q4 2019. Net loss int he quarter was $1.6 million, but the company generated $0.6 million in cash flow - Everspin's second consecutive positive cash flow from operations quarter.
Looking at FY2020, Everspin's revenues increased 12.1% to $42 million. At the end of the year, Everspin had $14.6 million in cash and equivalents. In Q4 2020, the company also received its first royalty revenue from GF for embedded 22FDX process MRAM.
In March 2019 Samsung Electronics announced that it has started to mass produce its first embedded MRAM, made using the company's 28nm FD-SOI process. The company now announced that it managed to improve the MTJ function of its MRAM, which makes it suitable for more applications.
Samsung will now expand the application of its eMRAM solutions to more markets - specifically the automotive, wearable, graphic memory, low level cache, internet of things and edge artificial intelligence markets.