Taiwan Semiconductor Manufacturing Company (TSMC) is the world's leading semiconductor contract manufacturing and design company.
TSMC is currently offering 22nm eMRAM option as an eFlash alternative. The company is also developing 16, 14 and 12 nm eMRAM options to replace SRAM memory.
GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers with a global footprint. GF was established in 2008 as a spin-off from AMD (which became fabless).
GF is offering embedded MRAM solutions on its 22FDX 22nm platform, based on Everspin's MRAM IP. The company is also developing MRAM solutions for 12 nm processes.
Netsol was established in Korea in 2010, targeting the niche memory markets. The company offers SRAM memory devices and STT-MRAM solutions.
Netsol's first MRAM products are offered in densities of 1Mb to 64 Mb, with either serial or parallel interfaces. The company started mass producing its MRAM products in August 2023.
Spin-Ion Technologies, established in 2017 as a spin-off from CNRS, developed a unique patented process that increases the performance of MRAM magnetic layers - by improving the homogeneity, increasing the magnetic performance and increasing yields.
Established in 2011 in the US, Rangduru developed an MRAM memory structure called DX MRAM that uses a cell structure that is twice as dense as current MRAM structures.
Rangduru operates in a fabless model and develops both discrete MRAM chips and embedded MRAM technologies.
HFC Semiconductor develops MRAM technology for both stand-alone and embedded applications.
HFC plans to build its own full MRAM production facility.
Crocus Nanoelectronics (CNE) was established in 2011 in Russia by Rusnano (as a joint-venture with Crocus Technology, which holds 20% of CNE). CNE is an advanced 300 mm wafer fab for 90/65 nm nodes.
CNE focuses on emerging technology and devices, including non-volatile memories, magnetic sensors, bio-electronic sensors, integrated passive devices, wafer level magnetics and highly engineered semiconductor wafer processing. CNE has its own STT-MRAM project with plans to offer embedded STT-MRAM solutions.
Cobham (formerly Aeroflex microelectronic solutions) designs and produces high-reliability ICs, components and systems for several markets including the aerospace and defense ones.
Cobham licensed Everspin's MRAM technology and released its first MRAM chips in 2012. Cobham offers 16Mbit and 64Mbit MRAM chips.
California-based Avalanche Technology is a start up company founded in 2006 to develop patented Spin Programmable perpendicular STT-MRAM (SPMEM) memory that uses a revolutionary proprietary spin current and voltage switching technology that enables lower write current, smaller cell size, higher density and excellent scalability.
Avalanche Technology currently offers STT-MRAM chips up to 64Mb in size, in both discrete and embedded form.
The NEC Group focuses on two core areas of business: integrated IT / network solutions and semiconductor.
NEC has been developing MRAM technologies for a long time, collaborating with both TMSC and Toshiba. NEC are also working on perpendicular MRAM. NEC planned to commercialize pMTJ-based MRAM chips by 2010, but that plan did not materialize, and it is not clear if NEC still develops MRAM technologies.
