Everspin announced that it has started shipping samples based on its perpendicular magnetic tunnel junction (pMTJ) ST-MRAM. The first chip is the EMD3D256MB - a 256Mb DDR device. This is Everspin's 3rd-gen MRAM technology.

The pMTJ ST-MRAM offers improved performance, higher endurance, lower power, and better scalability compared to previous MRAM and ST-MRAM products. The company (together with GlobalFoundries) is now focused on the production ramp of the 256Mb MRAM and is working on a scaled-down 1Gb version.

Everspin announced that it started shipping 256Mb ST-MRAM samples to customers. Everspin also plans to increase the density and sample 1Gb ST-MRAM chips later this year. The new chips demonstrate interface speeds comparable to DRAM, with DDR3 and DDR4 interfaces. Volume production is expected "soon".

The new EMD3D256 chips are based on Everspin's proprietary magnetic tunnel junction (pMTJ) spin torque technology - and the company expects the new technology to enable it to produce ST-MRAM in lower geometries - and higher densities beyond 1Gb in the future.

Everspin Technologies announced that it closed a $29 million funding round, led by Global Foundries and Western Digital Capital. Existing investors (New Venture Partners, Lux Capital, Sigma Partners, Epic Ventures, and Draper Fisher Jurvetson) also joined in the round.

In October 2014 Everspin entered into a partnership with GlobalFoundries to build fully processed 300mm wafers with Everspin's ST-MRAM technology. In October it was announced that GF acquired a stake in Everspin (this is probably before this recent investment) and also acquired ST-MRAM processing equipment (40-nm).

Everspin Technologies entered into a partnership with GlobalFoundries to build fully processed 300mm wafers with Everspin's ST-MRAM technology, starting with GF's 28-nm and 40-nm low-power CMOS platforms. As part of the agreement, GlobalFoundries invested an undisclosed amount in Everspin, and they already acquired ST-MRAM processing equipment (40-nm).

Everspin hopes that the new agreement will help drive ST-MRAM adoption and will offer higher volume production at lower cost. The company reports that they shipped over 40 million MRAM chips - which represents very fast growth as in August 2013 they reported selling 10 million MRAM chips so they sold almost 30 million chips in just over a year (it took them over 4 years to sell the first 10 million).

GlobalFoundries announced it is joining Qualcomm and Imec (and other companies) in their joint development effort to advance STT-MRAM technology. GlobalFoundries is the first IC maker to join imec's R&D program on emerging memory technologies. Imec says that they now have the complete infrastructure necessary for STT-MRAM R&D.

Imec and the other members aim to explore the potential of STT-MRAM, including performance below 1ns and scalability beyond 10nm for embedded and standalone applications.