In September 2016 Everspin announced that its perpendicular (pMTJ) STT-MRAM memory is going to be deployed by Global Foundries as an embedded 22nm memory (as part of the 22FDX platform). Today GlobalFoundries (GF) announced that eMRAM technology is now available for the 22FDX platform.
GF says that its eMRAM technology is the industry's most advanced embedded memory solution, and it provides high performance and superior reliability for broad applications in consumer and industrial controllers, data centers, Internet of Things, and automotive.
GFâs 22FDX eMRAM features the ability to retain data through 260Â°C solder reflow, while maintaining an industry-leading eMRAM bitcell size that retains data for more than 10 years at 125Â°C, enabling the technology to be used for general purpose, industrial, and automotive MCUs. GF says that the high reliability and superior scalability of GFâs eMRAM makes it a cost effective option at advanced process nodes.
GF is now offering process design kits for 22FDX eMRAM coupled with RF solutions. GF expects customers to start prototyping MRAM on multi-project wafers (MPWs) to start in Q1 2018, with risk production planned by the end of 2018. Custom eMRAM design services are available today from GF and its design partners, including eMRAM macros ranging from 2Mb to 32Mb, featuring easy design-in eFlash and SRAM interface options.