MRAM applications

Everspin Technologies announced its newest high-reliability additions to the PERSYST MRAM product line: the EM064LX HR and EM128LX HR devices.  These two new xSPI MRAM products are designed for extreme operating environments, with high endurance, temperature performance and data retention. Everspin is targeting aerospace, defense, automotive and high-end industrial applications for these new chips. 

Everspin's new MRAM chips have received an AEC-Q100 Grade 1 qualification for operation from -40°C to +125°C. Each device undergoes a 48-hour burn-in process and provides 10-year data retention at 125°C, ensuring predictable performance even under the most demanding conditions. With 64- and 128-megabit densities achieving 90 Mbytes/sec read and write bandwidth, sustained for over a decade, the EM064LX HR and EM128LX HR are built for systems that cannot risk data loss or degradation.

Frontgrade Technologies announced that it has expanded its MRAM product line, adding two new series, the Dual Quad Serial Peripheral Interface (Dual QSPI) series and the Parallel series. With these new MRAM chips, Frontgrade is targeting aerospace, defense, and industrial applications.

The Dual QSPI series, powered by STT-MRAM, offers a wide range of densities, 128Mb and 1/2/4/8Gb. These new devices bring flash-like non-volatility with SRAM-level speed and endurance. The Dual QSPI interface enables high-speed, synchronous communication and seamless integration into new or existing architectures. These memory chips are designed for boot, configuration, code execution, and data logging.

TSMC is launching its first design center in Europe, with a focus on memory technologies for automotive applications. The company announced that it will start developing 5nm MRAM technologies, to complement its 22-nm (in production), 16-nm (ready for customers verification) and 12-nm (already in development) technologies. 

Scaling MRAM technology to 5nm will be a significant step, required, according to TSMC, to implement AI automotive chips and technologies. The company will also develop 6 nm RRAM memory in the new design center.

Researchers from Beihang University and Truth Memory Corporation have fabricated a 1 Kbit SOT-MRAM chip using a 180 nm complementary metal oxide semiconductor (CMOS) process, and implemented a physical unclonable function (PUF) on it. This research represents a significant step forward in the field of PUFs.

The newly developed SOT-MRAM sr-PUF achieves a strong, highly reliable, and reconfigurable PUF that can resist machine-learning attacks. The performance of the SOT-MRAM sr-PUF is remarkable - it has a challenge-response pair (CRP) capacity of 109. Its uniformity is 50.07%, diffuseness is 50%, uniqueness is 49.89%, and the bit error rate is 0%, even in a 375 K environment. These values are near-ideal, indicating excellent randomness and reliability.

Everspin Technologies announced new additiontions to its PERSYST EMxxLX family, the EM064LX HR and EM128LX HR, targeting automotive applications. These new chips will operate at temperatures from -40°C to +125°C, meeting the AEC-Q100 Grade 1 standard.

The new chips offer capacities of 64Mb and 128Mb, Quad SPI Interface, fast write speeds and a simple architecture. Everspin will start offering engineering samples in June 2025, with mass production scheduled by the end of the year.

High-performance STT-MRAM developer Numem announced that it expects to start samplings its MRAM chipsets, to enable non-volatile, high-speed and ultra-low power solutions to chip designers.

Numem says that the company's chiplets deliver up to 4TB/sper 8-die memory stack, exceeding existing AI memoryHBM solutions.  It supports 4GB per stack package, and is optimized for AI applications across OEMs and hyperscalers.

Vertןcal Compute, a new startup that was spun-off from the imec institute to commercialize its MRAM technology for AI applications, has raised 20 million Euro. The seed round was led by imec.xpand and supported by Eurazeo, XAnge, Vector Gestion, and imec.

The company says that it will develop an MRAM in-memory computing chiplet technology. The chiplet, according to the company, can reduce power consumption by 80% and speed up the execution of large language models for AI by 100X. It is believed that the company's MRAM is based on SOT-MRAM technology.

Everspin Technologies announced that Lucid Motors has chosen the company's PERSYST MRAM technology to be used in its latest all-electric Gravity SUV. 

Lucid's Gravity uses Everspin's MR25H256A, a 256Kb serial MRAM. Everspin says it was selected because it meets the AEC Q100 Grade 1 specification of -40C to 125C temperature operation. The MRAM is used in the Gravity to handle data logging and parameter storage to assist in the efficient operation of the all-electric powertrain.

US-based Carnegie Mellon University spinoff Efficient has signed a strategic partnership with GlobalFoundries to launch its low-power Fabric chip on GlobalFoundries' 22FDX low power silicon on insulator process. Efficient will adopt embedded MRAM in its chip, and expects to launch it (first samples) by the summer of 2025.

Efficient is an early stage company that raised over $16 million to develop the power-efficient Fabric processor, targeting edge applications such as machine learning-enabled extreme-edge machine vision, continuous audio intelligence and versatile sensory and signals intelligence.

GlobalFoundries has been offering eMRAM 22nm process solutions since 2017, based on Everspin's pMTJ technology and IP.

Researchers from the University of Minnesota Twin Cities developed a new AI hardware accelerator, based on MRAM memory, that can accelerate AI computation by a factor of 1,000. 

The so-calledd Computational Random-Access Memory device, or CRAM, is a machine learning inference accelerator, that is not just 1,000 faster, it also exhibits energy saves of 1,700 to 2,500 times compared to traditional methods.