In March 2019 Samsung Electronics announced that it has started to mass produce its first embedded MRAM devices, made using the company's 28nm FD-SOI process. In early 2021 Samsung announced that it managed to improve the MTJ function of its MRAM, which makes it suitable for more applications, and today, at the company's 5th Annual Samsung Foundry Forum, Samsung provides more details on its MRAM roadmap.
Samsung says it is advancing its 14 nm process which will support flash-type embedded MRAM which enables increased write speed and density. Samsung targets applications such as micro controller units (MCUs), IoT and wearables for its next-gen eMRAM.
Samsung's MRAM die that it detailed earlier this year is 40% smaller than SRAM. The company's MRAM boasts 30-50 ns read and write speeds, and the company aims to enhance the read and write speeds to be under 20ns.
Samsung says that its eMRAM is 1,000 times faster than its eFlash memory, and it does not require an erase cycle before writing data (unlike Flash memory). The voltage used is also lower - and in total eMRAM consumes 1/400 the energy compared to eFlash for the writing process. Samsung's MRAM capacity, though, is lower than its 3D Xpoint, DRAM and NAND flash.