Hprobe announced a new magnetic test head for MRAM Wafer Sort. The new module, the H3DM-XL, is at the heart of the latest addition to Hprobeâs IBEX line, the IBEX-WS.
The IBEX-WS test equipment integrates 3D magnetic field capabilities, while increasing field area and uniformity for wafer probing large MRAM arrays. It also features a unique patented robotized 3D Field Calibration Unit (FCU) for high-speed field mapping and monitoring.
Hprobe says that the test equipment platform integrating the new head is the only available commercial product designed to address the magnetic specificities of MRAM compared to traditional back-end testing in high volume manufacturing. Hprobe confirmed first customer shipments of the IBEX-WS.
The H3DM-XL test head enables the probing of large MRAM arrays (megabyte to gigabyte) under a magnetic field to accelerate per-bit retention testing and non-persistent bit failures in a production environment. The system, which features a high magnetic field and uniformity over a large surface, operates on single or multiple sites. It can also be used in product development, validation, and qualification phases.
The new test head is driven by high-end instrumentation from select partners, can operate with any type of electric tester and any programming language, and is integrated using Hprobeâs proprietary building blocks. The H3DM-XL is specially designed for testing MRAM arrays with bit cells based on Spin Transfer Torque (STT-MRAM) and Spin Orbit Torque (SOT-MRAM) magnetic tunnel junctions. This newest test head is complementary to the existing test heads available for Wafer Acceptance Test (WAT).