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December 2021

Researchers use MIFL to increase the magnetoresistance of pMTJs

Submitted by Ron Mertens on

Researchers from the University of Arizona developed a new pMTJ structure that exhibits high magnetoresistance, strong retention and is likely to achieve fast switching times as well.

pMTJ with multi-interface free layer (Arizona University)

The new structure uses a multi-interface free layer (MIFL) which incorporate multiple materials with different properties. The researchers used a ferromagnetic CoFeB layer with nonmagnetic Mo or MgO layers. The magnetoresistance can be controlled by changing the thickness of the CoFeB layer. The researchers managed to demonstrate a magnetoresistance of over 200%.

Renesas developed two technologies that reduce the power consumption of STT-MRAM chips by 72%

Submitted by Ron Mertens on

Renesas Electronics announced that it has developed two new technologies that reduce the energy and voltage application time for the write operation of STT-MRAM chips.

Renesas MRAM test chip die (2021 photo)

On a 20-Mbit test chip with embedded MRAM memory cell array in a 16 nm FinFET logic process, a 72% reduction in write energy and a 50% reduction in the voltage application time were confirmed.

Researchers from Tohoku University developed the world's smallest STT-MRAM MTJ

Submitted by Ron Mertens on

Researchers from Tohoku University managed to fabricate the world's smallest STT-MRAM MTJ, at 2 nm. In addition, the researchers demonstrated fast switching (3.5 ns) in sub-five-nm STT-MRAM MTJs.

10-nm MTJ TEM photo, Tohoku University

The new MTJ were developed using a new multilayered ferromagnetic structure that can engineer characteristic relaxation time, which governs the magnetization dynamics in the ns regime.

Hprobe launches a next-generation MRAM wafer sort magnetic test head

Submitted by Ron Mertens on

Hprobe announced a new magnetic test head for MRAM Wafer Sort. The new module, the H3DM-XL, is at the heart of the latest addition to Hprobe’s IBEX line, the IBEX-WS.

Hprobe MRAM Wafer-Sort Magnetic Test Head (IBEX-WS)

The IBEX-WS test equipment integrates 3D magnetic field capabilities, while increasing field area and uniformity for wafer probing large MRAM arrays. It also features a unique patented robotized 3D Field Calibration Unit (FCU) for high-speed field mapping and monitoring.