Applied Materials unveiled new high-volume manufacturing solutions for next-generation memories. The Endura platform integrates multiple materials engineering technologies along with on-board metrology to create new films and structures.

Applied Materials Endura Clover MRAM PVD system photo

Applied’s new Endura Clover MRAM PVD platform is made up of nine unique wafer processing chambers all integrated in pristine, high-vacuum conditions. Applied says that this is the industry's first 300-millimeter MRAM system for high-volume manufacturing capable of individually depositing up to five different materials per chamber. The Clover MRAM PVD platform includes on-board metrology that measures and monitors the thickness of the MRAM layers with sub-angstrom sensitivity as they are created to ensure atomic-level uniformity.

Applied Materials also announced a system for ReRAM and PCRAM production called the Endura Impulse PVD platform.

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