Applied Materials unveiled new high-volume manufacturing solutions for next-generation memories. The Endura platform integrates multiple materials engineering technologies along with on-board metrology to create new films and structures.
Applied’s new Endura Clover MRAM PVD platform is made up of nine unique wafer processing chambers all integrated in pristine, high-vacuum conditions. Applied says that this is the industry's first 300-millimeter MRAM system for high-volume manufacturing capable of individually depositing up to five different materials per chamber. The Clover MRAM PVD platform includes on-board metrology that measures and monitors the thickness of the MRAM layers with sub-angstrom sensitivity as they are created to ensure atomic-level uniformity.
Applied Materials also announced a system for ReRAM and PCRAM production called the Endura Impulse PVD platform.