Spin Memory (previously Spin Transfer Technologies), established by established by NYU and Allied Minds, is developing STT-MRAM devices based on its Orthogonal Spin Transfer MRAM (OST-MRAM) technology.
In November 2018 Spin Memory licensed its Endurance Engine MRAM technology to Arm. In 2016 Spin Memory produced 20nm OST-MRAM MTJs, and said it is preparing to start delivering samples to select customers. In 2015 the company raised $70 million (in addition to $36 million raised in 2012) and in November 2018 the company announced its $52 million Series B funding round.
Back in October 2008 we have interviewed Vincent Chun, who was then the executive in charge.
The latest Spin Memory news:
Researchers from Tokyo's Institute of Technology (Tokyo Tech) developed a new MRAM cell structure (called USMR MRAM) that features a very simple structure with only two layers - which could hopefully enable lower-cost MRAM devices.
The new design uses a combination of a topological insulator with a ferromagnetic semiconductor which enables a giant unidirectional spin Hall magnetoresistance (USMR).
Spin Memory (previously Spin Transfer Technologies) announced that is has signed a licensing agreement with Arm. The license includes Spin Memory's Endurance Engine technology and IP - and as part of the agreement Arm and Spin memory will also work together to create SRAM-class MRAM design solutions.
Spin Memory's Endurance Engine is a design architecture that is used to develop embedded MRAM solutions.
Spin Transfer Technologies (STT) announced that its unique Precessional Spin Current (PSC) structure can increase the spin-torque efficiency of any MRAM device by 40-70 percent, which means dramatically higher data retention while consuming less power.
Following advanced testing, the company says that these higher spin-torque efficiencies translate to retention times lengthening by a factor of over 10,000 while reducing write current.
ActualTech Media RoadCast posted an interview with Spin Transfer Technologies (STT) CEO, Tom Sparkman, who explains the company's history, technology and business:
ActualTech Media also posted an interview with STT's VP of product, Andy walker, who gives an MRAM technology primer:
Spin Transfer Technologies (STT) announced that it has signed an agreement with Tokyo Electron (TEL) to collaborate on the development of next-generation SRAM and DRAM-class STT-MRAM devices.
Spin Transfer Technologies says that the combination of its STT-MRAM technology with TEL’s advanced PVD MRAM deposition tool will allow the companies to quickly develop processes for the highest density and endurance devices.
Spin Transfer Technologies announced that it has raised $22.8 million via a convertible bridge facility. STT says that this will help the company get ready to complete its Series B funding round, targeting strategic investors and planned to conclude by end of Q1 2018.
In January 2017 STT announced that it has started to deliver fully functional ST-MRAM samples to customers in North America and Asia. The sample devices are based on the company's Orthogonal Spin Transfer Magneto-Resistive Random Access Memory technology (OST-MRAM), and use 80nm perpendicular magnetic tunnel junctions (MTJs)., the latest generation of MRAM technology.
Spin Transfer Technologies announced that it started to deliver fully functional ST-MRAM samples to customers in North America and Asia.
The sample devices are based on the company's Orthogonal Spin Transfer Magneto-Resistive Random Access Memory technology (OST-MRAM), and use 80nm perpendicular magnetic tunnel junctions (MTJs)., the latest generation of MRAM technology.
STT is now preparting to deliver OST-MRAM samples to select customer, following requests from "certain major semiconductor and systems companies". The company is processing more than 40 wafer lots at its R&D fab in Fremont, California.
Spin Transfer Technologies (STT) has successfully produced a working prototype STT-MRAM device. The company's advanced prototyping magnetics processing line at its facility in Fremont, California, is now fully operational.
STT's prototypes incorporate proprietary, performance-enhancing ‘spin-filtering’ technology, and were fabricated on industry standard CMOS wafers sourced from a high volume Asian foundry supplier. The prototypes are based on 60-nm perpendicular magnetic tunnel junction devices
In November 2013, Crocus Technology filed an Inter Partes Review petition to the US PTO, claiming that Spin Transfer Technologies's US patent #6,980,469 describes a technology already used in prior art, in particular in the patent portfolio of Crocus. In April 2014, the USPTO issued a preliminary decision in favor of Crocus' petition.
Crocus now says that it has prevailed in the Inter Partes Review of the patent. Crocus petitioned to cancel all or part of the patent as Crocus’s patent portfolio includes a patent on this technology that makes advanced non-volatile memory blocks more efficient. After careful consideration, the Patent Trial and Appeal Board of the US Patent and Trademark Office issued its final written decision cancelling or finding unpatentable all but three claims of the ’469 patent.