Everspin Technologies announced its newest high-reliability additions to the PERSYST MRAM product line: the EM064LX HR and EM128LX HR devices. These two new xSPI MRAM products are designed for extreme operating environments, with high endurance, temperature performance and data retention. Everspin is targeting aerospace, defense, automotive and high-end industrial applications for these new chips.
Everspin's new MRAM chips have received an AEC-Q100 Grade 1 qualification for operation from -40°C to +125°C. Each device undergoes a 48-hour burn-in process and provides 10-year data retention at 125°C, ensuring predictable performance even under the most demanding conditions. With 64- and 128-megabit densities achieving 90 Mbytes/sec read and write bandwidth, sustained for over a decade, the EM064LX HR and EM128LX HR are built for systems that cannot risk data loss or degradation.
Everspin says that the EM064LX device underwent independent radiation testing at the Berkeley Accelerator Space Effects (BASE) Facility at Lawrence Berkeley National Laboratory under a NASA Jet Propulsion Laboratory program. The tests validated the device’s high-reliability characteristics, showing no single-event latch-up (SEL) events up to an LET of 61 MeV-cm²/mg at ambient temperature. The EM064LX HR and EM128LX HR share the same design architecture and high-reliability specifications, supporting consistent performance across both devices. The new solutions feature a Quad Serial Peripheral Interface (QSPI) supporting 133 MHz single transfer rate and 90 MHz dual transfer rate operation, delivering high bandwidth for data-intensive applications while maintaining the deterministic performance MRAM is known for.
Disclosure: the Author of this post holds shares in Everspin
