October 2021

Advanced aerospace and defense mission-critical electronics developer CAES announced that its radiation-hardened microelectronic devices are on their way to Jupiter, as part of NASA’s Lucy Mission.

Lucy’s payload is comprised of a high-resolution visible imager, an optical and near-infrared imaging spectrometer and a thermal infrared spectrometer. CAES says that the payloaduses two memory devices - 16 Mbit SRAM and 16 Mbit MRAM. The company's UT8MR2M8 chip (shown above), basedon Everspin's MRAM, is a high performance, space grade, 16Mb non-volatile MRAM device with proven flight heritage.

In March 2019 Samsung Electronics announced that it has started to mass produce its first embedded MRAM devices, made using the company's 28nm FD-SOI process. In early 2021 Samsung announced that it managed to improve the MTJ function of its MRAM, which makes it suitable for more applications, and today, at the company's 5th Annual Samsung Foundry Forum, Samsung provides more details on its MRAM roadmap.

Samsung says it is advancing its 14 nm process which will support flash-type embedded MRAM which enables increased write speed and density. Samsung targets applications such as micro controller units (MCUs), IoT and wearables for its next-gen eMRAM.