Hynix

Hynix and Numonyx to make NAND and mobile DRAM together, might drop STT-MRAM program

mram — Thu, 07 Aug 2008 23:57:40 -0500

Flash and DRAM manufacturers Hynix and Numonyx will jointly develop NAND flash and mobile phone DRAM product over a 5-year term.

The two suppliers have signed an agreement to expand their existing program with stated aims being:

Expand their program for NAND flash and broaden NAND product lines.
Collaborate on mobile DRAM technology for mobile phones.

Hynix has licensed STT-MRAM from Grandis, and Numonyx has inherited Intel's PCM memory technology.

Samsung and Hynix to launch STT-MRAM JV in September, expect the chip to mature around 2012

mram — Wed, 25 Jun 2008 00:51:52 -0500

Samsung and Hynix are to launch their STT-RAM JV in September (after having announced their intentions in January 2008).

Hynix licenses Grandis' STT-RAM technology

mram — Wed, 02 Apr 2008 00:50:28 -0500

Hynix Semiconductor Inc. and Grandis Inc. have signed a license agreement for memory products involving Grandis' patents and intellectual property (IP) in the spin-transfer torque random access memory (STT-RAM) arena.

Hynix and Grandis have also entered into a collaborative agreement to jointly integrate Grandis' STT-RAM technology into Hynix' future memory products. Technical teams from both companies will work together to implement Grandis' STT-RAM technology, including magnetic tunnel junction (MTJ) materials and structures.

Samsung and Hynix to jointly develop STT-MRAM

mram — Thu, 24 Jan 2008 10:51:39 -0600

Samsung Electronics and Hynix Semiconductor, the world's two largest memory chip manufacturers, have agreed to join hands to develop the next generation of semiconductors so that South Korea can stay competitive with its foreign rivals.

Under the three-stage plan A total of about 50M$ will be spent to design and build futuristic chips such as the spin-torque-transfer magnetic-random-access-memory (STT-MRAM) and various non-volatile memory devices.

Hynix to produce PRAM memory by 2009

mram — Wed, 25 Jul 2007 23:52:06 -0500

It aims to produce a next-generation memory chip called Phase-change Random Access Memory (PRAM) by 2009. Industry analysts expect it to become the main memory device, replacing high-density flash memories, within the next decade.