IBMMacronix extends their phase-change memory alliance with IBM01/29/2010Digitimes reports that Macronix has signed an agreement with IBM to continue to co-develop phase-change memory (PCM) technology. The company said it is optimistic about the outlook for PCM, which is likely to be a successor to all memory products used in computers and consumer electronics devices. IBM shows new STT-MRAM tech with 20-fold increase in capacity, up to 64Mbit12/16/2008
The STT-RAM is part of the joint-research with TDK, announced in 2007 Via EETimes IBM shows New racetrack memory technology04/11/2008
TDK to mass-produce high-capacity MRAM chips in 200810/01/2007After partnering with IBM in August, TDK now plans to produce high-capacity MRAM chips in 2008. It plans to make even higher-density chips in 2011. IBM teams with TDK to develop STT-RAM08/20/2007
New Magnetic tunnel junctions for MRAM devices patent for IBM12/13/2006
Methods of manufacturing MTJ memory cells and structures thereof. A diffusion barrier is disposed between an anti-ferromagnetic layer and a pinned layer of an MTJ memory cell to improve thermal stability of the MTJ memory cell. The diffusion barrier may comprise an amorphous material or a NiFe alloy. An amorphous material may be disposed adjacent a bottom surface of a tunnel junction, within a free layer, or both. An MTJ memory cell with improved thermal stability and decreased Neel coupling is achieved. IBM's Magnetic Race-Track Memory04/30/2005
|
|