Epson, Fujitsu Announce Next-Gen FRAM Technology Project Results
Through the project, the two companies developed technology for forming, processing and evaluating a new ferroelectric (PZT) film and created FRAM memory core process technology that is highly integrated (four times the level of conventional FRAM), features high performance (read/write speeds over three times faster than conventional FRAM) and offers a high degree of reliability (capable of more than 100 trillion read/write cycles). FRAM is currently attracting attention as a technology for secure memory, and this level of performance is claimed to be a world first. Since the ferroelectric process can be added to existing CMOS logic processes, it will be suitable for the development of mass production technologies.
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