MRAM: Next generation memory technology

Emerson Network Power to use Everspin's MRAM in their industrial computing boards

Emerson Network Power says they will use Everspin's 4Mb MRAM in three of their newest high-performance single-board computers (the MVME7100 and MVME4100 VMEbus boards and CPC16200 CompactPCI board).

EverSpin MR2A16 Chips

Emerson's boards are used in industrial, medical, military, aerospace and advanced telecom platforms.

07/14/2009

New Graphene-Info site launched

We're happy to announce a new addition to the Metalgrass site network: Graphene-Info. Graphene is a sheet, one-atom-thick of carbon atom, in a honeycomb crystal lattice. If you use many layers of graphene, stacked one on top of the other, you’ll get Graphite. Graphene has many uses - Spintronics, sensors, ICs (for example a transparent backplane for OLEDs), ultra-capacitors and more.

07/13/2009

Avalanche and ISI developed a new wafer level analyzer for STT-MRAM

Avalanche Technology and Integral Solutions International (ISI) have designed a Wafer Level Analyzer, the WLA-3000, to be used in STT-MRAM development.

The WLA-3000 includes specific hardware test modules including nS-range Pulse Generator that quickly measures switching currentse of MTJ devices in STT-MRAM as a function of Pulse Width. Using this Pulse Generator module, customers will be able to perform Error Rate, Switching Probability, Endurance Testing, and Read/Write Disturb analysis in a fraction of time as compared to other slower pulsers.

07/09/2009

Riber launches an innovative robotic system in 300mm SEMI process modules

Riber has launched a new innovative robotic system, the MPVD300 reactor. Based on a high vacuum deposition system (UHV) and compatible with existing silicon FAB industry standards, the MPVD 300 provides unrivalled precision of control and composition uniformity defects of less than 1% over 300mm (monoatomic layer precision).

Riber sayst he new machine willhelp make new ultra-fast microprocessors and high-capacity MRAM.

Fully automated, Riber's MPVD300 is the only modular system for high vacuum deposition that can beconnected up directly to the silicon production line. The first system will be shipped in July to a major manufacturer in Asia.

07/02/2009

Tower to make MRAM chips for Crocus, also invests 1.25M$

Crocus announced today that Israeli Tower fab will manufacture their next-gen MRAM chips. Tower has an exclusive agreement to make the MRAM chips at their 200mm Fab2 facility. Tower has also invested 1.25$ at Crocus.

Crocus aims to start making the chips towards the end of 2009.

06/18/2009

NEC to commercialize perpendicular MRAM chips in 2010

A couple of days ago we reported that NEC are working towards perpendicular MRAM using 2T1MTJ... now we have some more info, thanks to TechOn.

NEC and NEC Electronics employed a new method called "spin torque domain wall displacement write method" to reduce write current and realize microfabrication at the same time. In fact, they aim to reduce the current by as much as 90%. They were also able to increase speed to 500Mhz. This technology is not 'new', it was announced in 2007, but now they have a test chip ready.

06/17/2009